Wafer scale graphene integrated circuit pdf




















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Corresponding author. Received Jan 21; Accepted Sep Abstract Triggered by the pioneering research on graphene, the family of two-dimensional layered materials 2DLMs has been investigated for more than a decade, and appealing functionalities have been demonstrated. Subject terms: Electrical and electronic engineering, Two-dimensional materials, Electronic devices.

Introduction Two-dimensional 2D semiconductors have potential applications from mainstream logic and analog circuits to flexible electronics 1 — 8. Open in a separate window. Machine learning assisted optimization of MoS 2 -device process. Wafer-scale fabrication To demonstrate the potential for high-volume production, we fabricated MoS 2 TG-FET arrays and 1-bit full-adder arrays on a 2-inch wafer, as shown in Fig.

Discussion The synthesis of wafer-scale MoS 2 and other 2D semiconductors is currently under fast development, providing more material candidates for fabricating FETs and ICs. The machine-learning method The details of ensemble learning, random-forest algorithm, and feature-importance assessment are described in Supplementary Note 3. Supplementary information Supplementary Information 2.

Peer Review File 4. Acknowledgements We thank Prof. Author contributions W. Code availability The codes used for simulation and data plotting are available from the corresponding authors upon reasonable request. Competing interests The authors declare no competing interests.

Footnotes Peer review information Nature Communications thanks Dmitry Polyushkin, Yi-Hsien Lee and the other anonymous reviewers for their contribution to the peer review of this work.

Contributor Information Peng Zhou, Email: nc. Supplementary information The online version contains supplementary material available at References 1. Li N, et al. Large-scale flexible and transparent electronics based on monolayer molybdenum disulfide field-effect transistors. Liu F, et al. Disassembling 2D van der Waals crystals into macroscopic monolayers and reassembling into artificial lattices. Zhang Z, et al. Robust epitaxial growth of two-dimensional heterostructures, multiheterostructures, and superlattices.

Li J, et al. General synthesis of two-dimensional van der Waals heterostructure arrays. Pospischil A, et al. CMOS-compatible graphene photodetector covering all optical communication bands.

Yang Y, et al. Mennel L, et al. Ultrafast machine vision with 2D material neural network image sensors. Liu Y, et al. Van der Waals heterostructures and devices. Nourbakhsh, A. Wang, H. In International Electron Devices Meeting.

The measured output spectrum is shown in Fig. The conversion gain of the circuit with 4. The circuit is designed to band-pass filter the RF input signal before entering the mixer to improve the data quality by rejecting unwanted signals outside the carrier frequency band.

The effective RF input filtering can be seen from the sharp frequency response in Fig. The receiver conversion gain is also measured as a function of the LO frequency Fig.

The original bit stream comprising three letters 24 bits was recovered by graphene receiver with very low distortion. To best demonstrate the true functionality of the graphene IC, an RF carrier of 4. Measured single bit waveforms in Fig. The original binary code can then be easily recovered by rectification and low-pass filtering. The modulation rate is limited by the test equipment, and not by the receiver IC.

Such integration concept fully utilizes the transfer property of graphene, and one can envision that high-performance graphene RF circuits will be directly built on top of high-density Si CMOS logic circuits to form an extremely low-cost, ultra-compact communication system.

A Cu foil The graphene was transferred to a target substrate with typical wet transfer process. A total of nine lithography masks are required to complete the IC fabrication. The measured capacitance of plate capacitors is 6. Cu vias and following metal levels were fabricated using similar process steps with different dielectric thickness and etch time. The mixer and amplifier outputs were measured with an Agilent EA spectrum analyser. Modulation of the input RF signal was performed by driving the RF signal generator amplitude modulation input with a data pattern stored on an Agilent pulse generator.

The demodulated signal was observed on an Agilent DSAA real-time oscilloscope, which also performed the rectification and low-pass filtering to convert it to digital format.

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Sarkas, I. IEEE J. Solid State Circuits 45 , — Huang, S. Solid State Circuits 46 , — Kim, K. Download references. Chalmers University of Technology, Gothenburg, , Sweden. You can also search for this author in PubMed Google Scholar. All authors discussed the results and commented on the manuscript.

Correspondence to Omid Habibpour. This work is licensed under a Creative Commons Attribution 4. Reprints and Permissions. Sci Rep 7, Download citation. Received : 22 August Accepted : 28 December Published : 01 February Anyone you share the following link with will be able to read this content:. Sorry, a shareable link is not currently available for this article. Provided by the Springer Nature SharedIt content-sharing initiative.

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Subjects Electrical and electronic engineering Electronic properties and devices. Abstract In recent years, the demand for high data rate wireless communications has increased dramatically, which requires larger bandwidth to sustain multi-user accessibility and quality of services.

Introduction To meet the fast growing demand for telecommunication services, developing high-data-rate communication links in the range of multi-gigabit per second Gbps is necessary.

Graphene based high data rate wireless communication landscape Figure 1a shows a prospective application for graphene based high speed electronics. Figure 1: Graphene based high data rate communication landscape. Full size image. Figure 3: Signal modulation and eye diagram.



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